Semiconductor products

Innovative Semiconductor Solutions and Services

Here you can find out all about what we offer in the field of semiconductors, discover our products and early adopter solutions, explore our services and get to know our partners. Experience innovation and collaboration at first hand.

Innovative Semiconductor Solutions Await You

Turning Science into Solutions

LZE GmbH offers a wide range of semiconductor products and individual services based on the latest research results. Our solutions, developed in cooperation with leading research partners, enable seamless integration into your products. As a fabless semiconductor manufacturer, we always strive to offer innovative technologies that meet your requirements. With a clear focus on quality and progress, we look forward to shaping the future of the semiconductor industry together with you.

IC tuning service
With our IC tuning service, you can get the best out of our components for your application. Be it through customized firmwares, calibrations or certifications for extreme conditions.
Custom IC Design
Perfect-Fit-Solution: Full-Custom ASIC, which is completely designed according to customer requirements. Your own circuit, developed according to the latest findings in cooperation with our research partners. Provided by our certified supply chain.
4H-SiC High Temperature Sensors & Electronics
We are your partner for customized high-temperature CMOS solutions. Our team of experienced experts develops and manufactures circuits that function reliably even under the most adverse conditions up to 500° C.
EUROPRACTICE
The EUROPRACTICE platform promotes the growth of an ecosystem for microelectronic design in Europe. In cooperation with Fraunhofer IIS, we create the interface to the EUROPRACTICE services for foreign interested parties.

Our current product highlights

From the semiconductor sector

HallinOne® FH3D02: Dual 3D Hall Sensor with EEPROM
The FH3D02 offers precise 3D magnetic field measurement at two positions with a planar IC in a 3 x 2 x 0.6 mm WLCSP housing.
RFicient® Ultra-Low-Power Wake-Up Receiver FH101RF IC
This device was specially developed for IoT applications that require long operating times and minimal maintenance.
HallinOne® FH3D04: Software Defined Quad 3D Hall Sensor
The FH3D04 offers a high dynamic magnetic range and accurate 3D magnetic field measurement at four positions with a planar IC.

Top-class partners

Our design and production partners

Department of Integrated Circuits and Systems, Fraunhofer IIS

In the Integrated Circuits and Systems business unit, we at Fraunhofer IIS, as one of the leading IC design facilities in Europe, develop customized solutions for the constantly evolving requirements of industry. Since we are independent of technology and manufacturers, we can offer our customers optimal solutions. Our focus is on mixed-signal ASIC design for e.g. high performance A/D and D/A converters, neuromorphic computing, circuit components for wired and optical communication links and application specific integrated RF IPs and ASICs. We also offer the entire value chain from design to production.

Department of Integrated Sensor Systems, Fraunhofer IIS

In the Sensor Systems division, we develop complete solutions in the field of intelligent integrated sensor systems, such as 3D magnetic field, image and color sensors and their wireless networking. These sensor systems form the basis for innovative information, communication and measurement systems. Intelligent sensors are key elements of modern, autonomous systems. Our new concepts of direct sensor signal conversion in combination with complex digital signal processing lead to efficient, small and cost-effective sensor elements.

Department of Integrated Digital Systems, Fraunhofer IIS

In the Integrated Digital Systems business unit, we at Fraunhofer IIS develop innovative and cost-effective chip solutions for a wide range of applications. We look back on over 30 years of cross-industry experience and specialize in digital and mixed-signal ASIC and SoC designs with customized RISC-V processors.

Department Chip Design Center, Fraunhofer IIS

In the Chip Design Center department at Fraunhofer IIS, we research new methods in the field of system engineering of complex integrated circuits. In addition, the office of the Bavarian Chip Design Center (BCDC) is organized within the department.

System Engineering supports the design of integrated circuits in requirements engineering, system design and examines modular and scalable system architectures with regard to chiplet systems and heterogeneously integrated ICs.

The BCDC office includes the management of the BCDC, the business development for a demand-oriented innovation management of the BCDC IC – Design Ecosystems and organizes the training and further education programs of the BCDC IC – Design Talents, e.g. through trainee programs for various job profiles in IC design or summer schools.

Our sales partners

Would you like to talk to us about your project? Whatever moves you – together we will find the right solution for your request.